Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

As the surface acoustic wave (SAW) filters incline to ultrafine, failures resulting from wafer molding process have become increasingly prominent. A methodology for coupling mechanisms of die fly and shift SAW filter miniatured with 737 μm × 517 200 is developed trade-off between reliability yields. In terms shift, former occurs before epoxy compound (EMC) cured in temperature rise period, while latter cooling stage after being cured. The induced by fluid flow force high-temperature heat compression, which fatal scrap. Followed stage, CTE (coefficient thermal expansion) misalignment seriously affects following lithography debonding critical energy mixed mode employed avert fly. Then, can be shunned fine-tuning thickness, layout, EMC layout. measure was conducted, a total 47,568 dies were embedded using compression molding. mechanical error mounter law are comprehensively leveraged, indicating that controlled within 50 8-inch wafer-level packaging.